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Tecknit Inc. USA
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Product Information |  |
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TECKBOND-C is a silicone rubber base filled with silver-plated copper particles to produce a highly conductive one-component adhesive sealant. The system is an RTV moisture-cured compound which is ready to use without additional preparation or mixing. The compound cures at room temperature to form a flexible resilient conductive bond or sealant. Contact our sales team for further product information and consultation. |
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| Application Information. TECKBOND conductive adhesive-sealants are recommended wherever a flexible bond is required in a metal-to-silicone gasket application, such as TECKNIT CONSIL®-C. These adhesives are recommended in applications where the bond thickness is less than 0.016 in [0.4 mm] To ensure optimum bond performance, the surface of the metal may require priming. |
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Specifications
| Material Description | |
|---|---|
| Number of Components | One |
| Resin | Silicone |
| Filler | Ag/Cu |
| As Supplied | |
| Colour | Gray |
| Consistency | Thick Paste |
| Final Condition | Flexible |
| Solids | N/A |
| Mix Ratio | N/A |
| Volume | 2.5in.3/10 in.3 |
| Weight | 4oz/16oz |
| Density,g/cc (ASTM D-792) | 3.8 ± 13% |
| Pot life @ 25°C | 15 minutes |
| Shelf life, unopened container | 9 months |
| Tack Free | 2.5 hours |
| Full Cure | 168 hours |
| Cured | |
| Volume Resistivity, 25°C & 50% RH (QA-1038), max | .04 ohm-cm |
| Shear Strength, min (ASTM D-1002), | 200 psi |
| Peel Strength, min. (ASTM D-1876) (silicone-aluminium) | 2.5 ppi |
| Shrinkage, max | 1.0% |
| Temperature Range | -85°F to 360°F [-65°C to 182°C] |
| PART NUMBER | 72-00192 |
| Transportation Class | Flammable |
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